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    产品名称:K-303Pro 智能一体拆焊台

    Kaisi K-303Pro 一机通用所有手机主板,无需频繁更换加热模块。 

    支持i4~8、IX、XR、 IXS、IXSMAX以及一系列的安卓手机主板。

    Barcode (EAN)
    6922297053979




    产品介绍 定制要求 增值服务

    Kaisi K-303Pro 一机通用所有手机主板,无需频繁更换加热模块。 

    支持i4~8、IX、XR、 IXS、IXSMAX以及一系列的安卓手机主板。


    恒温差小,分区加热不怕爆锡,温度达到提醒

    倒计时模式,不会长时间加热,完成后强制快速散热

    休眠模式节能安全可靠,接地预防静电击穿。

    Kaisi K-303Pro can be used for all mobile phone motherboards in one machine, and there is no need to replace the heating module frequently.
    Support i4~8, IX, XR, IXS, IXSMAX and a series of Android mobile phone motherboards.
    The constant temperature difference is small, the zone heating is not afraid of tin explosion, and the temperature reaches the reminder
    Countdown mode, it will not heat up for a long time, and it will be forced to dissipate heat quickly after completion
    The sleep mode is energy-saving, safe and reliable, and the grounding prevents electrostatic breakdown.

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