产品无铅无卤，环保安全性能高

338BGA焊油

产品采用优质原材料，用于返修和补焊，可用于OSP保护铜垫（即是防裸铜，形成有机保焊膜，具有防氧化，耐冲性，耐湿性）

对球体表面形成的均匀分布都是比较优秀的

138℃/183℃/217℃锡膏

优良焊接性能，锡珠均匀细腻饱满，焊接牢固
印刷在PCB后仍能长时间保持其粘度，不变形不坍塌
对0.3mm及以上间距的电路，可完成精美的印刷

The product is lead-free and halogen-free, with high environmental protection and safety performance.
338BGA Soldering Oil
The product uses high-quality raw materials for rework and repair welding, and can be used for OSP protection copper pads (that is, anti-bare copper, forming an organic solder protection film, with anti-oxidation, impact resistance, and moisture resistance)
The uniform distribution formed on the surface of the sphere is excellent
138℃/183℃/217℃ solder paste
Excellent welding performance, the tin beads are uniform, fine and full, and the welding is firm
After printing on the PCB, it can still maintain its viscosity for a long time without deformation or collapse
For circuits with a pitch of 0.3mm and above, fine printing can be completed